From the Ars Technica article:
Intel has announced the 8th-generation H-series mobile processors will have a feature that’s nothing short of astonishing: they’ll integrate AMD GPUs.
The chip package will contain multiple pieces of silicon: an Intel CPU, a custom-built AMD Radeon GPU, and stacked second-generation High Bandwidth Memory (HBM2). Connecting the GPU and its memory is Intel’s new “Embedded Multi-Die Interconnect Bridge” (EMIB), a high-speed, short-range interconnect that Intel has designed to join different chips within a single package. Intel says that EMIB enables the creation of faster, thinner packages, enabling the multi-chip module to fit into slimline laptop form factors.
EMIB uses pieces of silicon to join the chips, rather than the circuit board traces found in conventional multi-chip modules. These pieces of silicon enable much denser packing of the interconnects. Overall, Intel claims that using EMIB shaves about 2.9 square inches (1,900 square millimeters) from the system motherboard and halves the power usage of a traditional design.
The company anticipates using EMIB for all kinds of integrations, such as processors with embedded FPGAs or other specialized chips. This AMD integration will be a good showcase for using the technology at scale. For AMD, it gives access to a market that tended to lean on Nvidia. Single-chip integrated graphics, even those found in AMD’s newly announced mobile Ryzen parts, just don’t offer the same performance as discrete parts with dedicated memory.